4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Chip mounted on chip

David A. Zoba

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Making leadframe semiconductor packages with stacked dies...

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate

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Method of making a semiconductor package including stacked...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Semiconductor package including stacked semiconductor dies...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2558754

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