4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Of specified material other than unalloyed aluminum

Christopher C. Thompson

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CMP of copper/ruthenium substrates

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Reexamination Certificate

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Polishing composition for noble metals

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Use of CMP for aluminum mirror and solar cell fabrication

Abrading – Abrading process – Glass or stone abrading
Reexamination Certificate

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Profile ID: LFUS-PAI-P-3029475

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