4. Plastic and nonmetallic article shaping or treating: processes
  5. Carbonizing to form article
  6. Agglomeration or accretion

Christine E. Vogdes

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Dissipation of heat from a circuit board having bare silicon chi

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Patent

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Dissipation of heat from a circuit board having bare silicon...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Laminate and method of preparing same

Stock material or miscellaneous articles – Composite – Of polyisocyanurate
Patent

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Marker device with permanent indicia

Stock material or miscellaneous articles – Hollow or container type article – Shrinkable or shrunk
Patent

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Method of making high strength polyethylene fiber

Plastic and nonmetallic article shaping or treating: processes – Carbonizing to form article – Agglomeration or accretion
Patent

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Profile ID: LFUS-PAI-P-261449

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