4. Semiconductor device manufacturing: process
  5. Chemical etching
  6. Combined with coating step

Chin-Kun Lo

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Metal bump with an insulating sidewall and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Metal bump with an insulating sidewall and method of...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Method of local oxidation using etchant and oxidizer

Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
Utility Patent

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Profile ID: LFUS-PAI-P-2031422

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