4. Electrical connectors
  5. With circuit conductors and safety grounding provision
  6. Grounding of coupling part

Chao-Yuan Liu

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Flip chip package process

Electrical connectors – With circuit conductors and safety grounding provision – Grounding of coupling part
Reexamination Certificate

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Thermally enhanced package structure

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Profile ID: LFUS-PAI-P-3228819

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