4. Adhesive bonding and miscellaneous chemical manufacture
  5. Methods
  6. Surface bonding and/or assembly therefor

Celerity Research Pte. Ltd.

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Adhesive control during stiffener attachment to provide...

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate

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Flip-chip package containing a chip and a substrate having...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
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Flip-chip package with underfill dam for stress control

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
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Flip-chip packaging method that treats an interconnect...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
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Pitch compensation in flip-chip packaging

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
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