4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Insulating material

Candy Tien

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Cavity-down ball grid array package with semiconductor chip...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Semiconductor package having a heat sink with an exposed...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Semiconductor package having an exposed heat spreader

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2049829

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