4. Fishing, trapping, and vermin destroying

Brook D. Raymond

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Bonding of integrated circuit chip to carrier using gold/tin eut

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
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Bonding of integrated circuit chip to carrier using gold/tin eut

Fishing – trapping – and vermin destroying
Patent

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Profile ID: LFUS-PAI-P-355537

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