4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. With contact or lead

Benjamin G. Tubera

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Multi-layered pin grid array interposer apparatus and method...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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System and method for thermal testing of circuit boards...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2520944

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