4. Stock material or miscellaneous articles
  5. All metal or with adjacent metals
  6. Composite; i.e., plural, adjacent, spatially distinct metal...

ASE Electronics (M) Sdn. Bhd.

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Flip-chip package with underfill dam for stress control

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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Surface preparation to eliminate whisker growth caused by...

Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...
Reexamination Certificate

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