4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor

Antonio Dimaano

Inventor

Rate now
  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Inventor

active

Package design and method of manufacture for chip grid array

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Package design and method of manufacture for chip grid array

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Semiconductor chip grid array package design and method of...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

No associations

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Antonio Dimaano does not yet have a rating. At this time, there are no reviews or comments for this inventor.

If you have personal experience with Antonio Dimaano, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Antonio Dimaano will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-P-2696862

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.

Canada

 Charities
 Companies
 MP Candidates
 Patents
 Employee Salary Disclosure

World

 Places of the World
 Scientific Papers

United States

 Banks
 Companies
 Counties
 Patents
 Employee Salary Disclosure