4. Metal working
  5. Method of mechanical manufacture
  6. Electrical device making

Ankor Technology, Inc.

Corporate Assignee

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Corporate Assignee

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Integrated circuit package having adhesive bead supporting...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Method of forming an integrated circuit device package using...

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2013643

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