4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. With contact or lead

Angel Orabuena Alvarez

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Encapsulated semiconductor package including chip paddle and...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Near chip size semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Stackable semiconductor package and method for manufacturing...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Stackable semiconductor package and method for manufacturing...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2616061

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