4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Andrew TS Pomerene

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Method for forming a micro column grid array (CGA)

Metal fusion bonding – Process – Preplacing solid filler
Reexamination Certificate

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Method for manufacturing microscopic canals within a...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Thermoelectric microactuator

Batteries: thermoelectric and photoelectric – Thermoelectric – Adjuncts
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2488916

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