4. Semiconductor device manufacturing: process
  5. Making point contact device

Andrew N. Camien

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Stack of equal layer neo-chips containing encapsulated IC chips

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Stackable layers containing encapsulated chips

Semiconductor device manufacturing: process – Making point contact device
Patent

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Profile ID: LFUS-PAI-P-206606

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