4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Encapsulating

Andrew J. Nagerl

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Apparatus for sealing a ball grid array package and circuit...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified filler material
Reexamination Certificate

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Method and apparatus for sealing a ball grid array package...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2052338

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