4. Solid material comminution or disintegration
  5. Processes
  6. With solidifying, consolidating or shaping

Ali Salem

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Method for producing an atta flour

Solid material comminution or disintegration – Processes – With solidifying – consolidating or shaping
Patent

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Semiconductor die with reduced bump-to-pad ratio

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Shroud for a used hypodermic syringe needle

Surgery – Means for introducing or removing material from body for... – Treating material introduced into or removed from body...
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1266438

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