4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame

Aik Seng Kang

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Electrical isolation in panels of leadless IC packages

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Locking lead tips and die attach pad for a leadless package...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Low inductance leadless package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Rotary mechanical buffing method for deflashing of molded...

Abrading – Abrading process – Utilizing nonrigid tool
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2430591

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