Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1991-01-22
1993-01-19
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
29846, 439 67, H01R 909
Patent
active
051803119
ABSTRACT:
An elastomeric member is incorporated between a conductor and a conductive interconnection bridge. This elastomeric member serves as a spring providing compliance to an interconnection so that the flatness requirements of an opposing mating structure may be relaxed. A flat metal mandrel is provided with an enlongated curved depression extending across a predetermined region where a resilient interconnection bridge is to be located. A nonconductive layer of Teflon is bonded to the surface of the mandrel. Grooves are ablated in a predetermined configuration down to the conductive surface of the mandrel using an excimer laser and a computer-controlled x-y table. Fineline electrical circuits are electrodeposited into the ablated grooves. The elongated curved depression is filled with a silicone material. The silicone material is permitted to cure to form a compliant elastomeric member having the shape of the elongated curved depression. An insulating backing is laminated onto the electrical circuits and the elastomeric member, and the completed resilient interconnection bridge is removed from the mandrel. Another method is used when the interconnection site is terminated on a circuit pad or on a high density linear connector configuration. In this method, elastomeric material is dispensed onto the circuit pad or along a line transverse to the high density linear connectors. After the elastomeric material has cured, electrical conductors are bonded thereacross to form raised compliant interconnection features.
REFERENCES:
patent: 4548451 (1985-10-01), Benarr et al.
patent: 4813129 (1989-03-01), Karnezos
patent: 4878070 (1989-10-01), Watrobski
patent: 4891014 (1990-01-01), Simpson et al.
IBM Bulletin, Essert, vol. 7, No. 10, p. 873, Mar. 1965.
Crumly William R.
Schreiber Christopher M.
Abrams Neil
Denson-Low Wanda K.
Gudmestad Terje
Hughes Aircraft Company
Walder Jeannette M.
LandOfFree
Resilient interconnection bridge does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Resilient interconnection bridge, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resilient interconnection bridge will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-99759