Patent
1989-03-07
1991-10-15
Hille, Rolf
357 80, H01L 2312, H01L 2314, H01L 2304
Patent
active
050579045
ABSTRACT:
A package and socket unit for testing a pin grid array package which includes a package having a plurality of pads electrically connected to pins and surrounding an area in which the pins are arranged, and a socket having contacts adapted to be electrically connected to the pads and provided with a chamber in which the pins are received without contact between the walls and the bottom of the chamber. The unit also may include a carrier for holding the package in the socket.
REFERENCES:
patent: 4390220 (1983-06-01), Benasutti
patent: 4441119 (1984-04-01), Link
patent: 4724472 (1988-02-01), Sugimoto et al.
patent: 4742385 (1988-05-01), Kohmoto
patent: 4793058 (1988-12-01), Lenaleck
patent: 4816426 (1985-03-01), Bridges et al.
patent: 4822550 (1989-04-01), Komathu
Nagato Mitsuki
Yoshizaki Thutomu
Clark S. V.
Fujitsu Limited
Hille Rolf
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