Thermal heat sink encapsulated integrated circuit

Details Thermal heat sink encapsulated integrated circuit Thermal heat sink encapsulated integrated circuit

1990-11-08

1991-10-15

James, Andrew J.

357 74, 357 80, 357 81, H01L 1100, H01L 2330

Patent

active

050579037

ABSTRACT:
An encapsulated integrated circuit which includes an integrated circuit die having a plurality of electric leads extending from the die. A thermal heat sink is positioned adjacent the die. The heat sink includes a thermoplastic material having a plurality of thermoconductive particles molded therein. A non-electrically conductive plastic material is sealably connected to the heat sink and encloses the die and seals around the leads. The heat sink plastic material is filled approximately 50 percent with metal particles, preferably in the form of powder. The particles may be from a group consisting of copper, aluminum, iron, carbon, aluminum nitride, silicon carbide, and boron nitride. The heat sink and the non-conductive plastic material have coacting interlocking interfaces.

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