Thin film capacitor coupons for memory modules and multi-chip mo

Details Thin film capacitor coupons for memory modules and multi-chip mo Thin film capacitor coupons for memory modules and multi-chip mo

1999-06-22

2000-12-26

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

438393, 438396, H01L 2144

Patent

active

061658146

ABSTRACT:
A semiconductor device including a thin capacitor coupon mounted to the backside of a semiconductor die. When mounted active surface up on a carrier substrate of a multi-chip module, the coupon is secured between the backside of the die and the substrate. When flip-chip connections or direct chip attach are employed between the die and substrate, the coupon is secured to the backside of the die. The coupons may be preformed, or formed on the die in a wafer-scale fabrication process prior to singulation of the dice.

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