Method of manufacturing a bonded semiconductor substrate and a d

Details Method of manufacturing a bonded semiconductor substrate and a d Method of manufacturing a bonded semiconductor substrate and a d

1994-11-14

1995-12-19

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437 31, 437 62, 437247, 437947, 437 33, 148DIG12, 148DIG51, 148DIG58, 148DIG150, 1566301, 1566621, 257586, H01L 2120

Patent

active

054768136

ABSTRACT:
In a method of manufacturing a bonded semiconductor substrate, a SiGe mixed crystal layer, a silicon layer containing N-type impurities, a SiGe mixed crystal layer containing N-type impurities of high concentration, and a silicon layer containing N-type impurities of high concentration are formed in this order on a top surface of a silicon substrate by an epitaxial growth process to form a first semiconductor substrate. A silicon oxide film is formed on a surface of a silicon substrate to form a second semiconductor substrate. The first and second semiconductor substrates are bonded to each other by heat treatment, with their top surfaces contacting each other. The first semiconductor substrate is etched from the back surface thereof until the SiGe mixed crystal layer is exposed, and the SiGe mixed crystal layer is etched until the silicon layer containing N-type impurities is exposed. This method prevents the thickness of the element forming layer from varying.

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