Superconducting multi-layer microstrip structure for multi-chip

Details Superconducting multi-layer microstrip structure for multi-chip Superconducting multi-layer microstrip structure for multi-chip

1994-08-17

1995-12-19

Ryan, Patrick J.

Stock material or miscellaneous articles

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428930, 428209, 428901, 505812, 505850, 505813, 505239, B32B 900

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active

054767199

ABSTRACT:
A multi-layer microstrip structure includes a substrate and a first superconducting layer deposited on the substrate. A first dielectric layer, made at least partially of benzocyclobutene (BCB), is deposited on the first superconducting layer. Additional superconducting dielectric and superconducting layers can be employed. Preferably the superconducting layers are made from niobium. The multilayer microstrip structure is ideally suited for use in passive circuit components of microwave circuits and in multi-chip modules.

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