Composition for circuit board manufacture

Details Composition for circuit board manufacture Composition for circuit board manufacture

1997-12-11

2000-04-25

Niebling, John F.

Etching a substrate: processes

Forming or treating electrical conductor article

216 2, 216106, 216108, 252 792, 252 793, 134 2, 134 3, B05D 512

Patent

active

060540613

ABSTRACT:
A process and composition for treating a metal surface to increase its surface roughness for subsequent adhesion to a polymer layer. The composition comprises hydrogen peroxide, inorganic acid, an amine free of a surfactant group and optionally, a corrosion inhibitor. The composition is characterized by elimination of a surfactant from solution.

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patent: 3948703 (1976-04-01), Kushibe
patent: 5800859 (1998-09-01), Price et al.
Derwent Info Ltd., Patent Abstract of Japanese Patent No. 51027819. Sep. 1974.
Derwent Info Ltd., Patent Abstract of Japanese Patent No. 3079778. Aug. 1989.
Derwent Info Ltd., Patent Abstract of Japanese Patent No. 6112646. Sep. 1992.

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