Process and apparatus for cutting of discrete components of a mu

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

156264, 156265, 156302, 156303, 156362, 156511, 156519, 156552, B26D 500, B26F 138, A61F 1315, B32B 3100

Patent

active

061653063

ABSTRACT:
A process for manufacturing a multi-component workpiece including cutting a first web of material moving at a first speed into first components, cutting a second web of material moving at a second speed into second components, transferring one of the first components onto a first surface moving at the first speed, transferring one of the second components onto a second surface moving at the second speed, adjusting the speed of the second surface to match the speed of the first surface, transferring the second component onto the first component, adjusting the speed of the first surface to match that of a third moving web, transferring the mated first and second components into the third moving web, readjusting the speed of the first surface to the first speed, and readjusting the speed of the second surface to the second speed. In a particular embodiment, the process manufactures a multi-component absorbent personal hygiene articles.

REFERENCES:
patent: Re29365 (1977-08-01), Butler, Jr.
patent: 2254217 (1941-09-01), Grupe
patent: 2958365 (1960-11-01), Molins et al.
patent: 3139243 (1964-06-01), Warwick et al.
patent: 3146152 (1964-08-01), Seragnoli
patent: 3516891 (1970-06-01), Hubin
patent: 3537934 (1970-11-01), Munch
patent: 3582437 (1971-06-01), Lenk
patent: 3645463 (1972-02-01), Helm
patent: 3728191 (1973-04-01), Wierzba et al.
patent: 3746599 (1973-07-01), Peeters et al.
patent: 3758367 (1973-09-01), Berg
patent: 3835756 (1974-09-01), Bosse
patent: 3858819 (1975-01-01), Butler, Jr.
patent: 3879246 (1975-04-01), Walker
patent: 3886031 (1975-05-01), Taitel
patent: 3904147 (1975-09-01), Taitel et al.
patent: 3918655 (1975-11-01), Hillner et al.
patent: 3939032 (1976-02-01), Taitel et al.
patent: 3957570 (1976-05-01), Helm
patent: 3963557 (1976-06-01), Patterson
patent: 3995791 (1976-12-01), Schoppee
patent: 4010911 (1977-03-01), Heitmann
patent: 4021293 (1977-05-01), Total
patent: 4045275 (1977-08-01), Stohlquist et al.
patent: 4061527 (1977-12-01), Traise
patent: 4083737 (1978-04-01), Foote, Jr. et al.
patent: 4120739 (1978-10-01), Peeters et al.
patent: 4157934 (1979-06-01), Ryan et al.
patent: 4190475 (1980-02-01), Marschke
patent: 4190483 (1980-02-01), Ryan et al.
patent: 4261782 (1981-04-01), Teed
patent: 4262855 (1981-04-01), Haag
patent: 4309236 (1982-01-01), Teed
patent: 4364787 (1982-12-01), Radzins
patent: 4371417 (1983-02-01), Frick et al.
patent: 4374576 (1983-02-01), Ryan
patent: 4394898 (1983-07-01), Campbell
patent: 4404058 (1983-09-01), Marchini
patent: 4443291 (1984-04-01), Reed
patent: 4455190 (1984-06-01), Bianchetto et al.
patent: 4481053 (1984-11-01), Tokuno et al.
patent: 4525229 (1985-06-01), Suzuki et al.
patent: 4572043 (1986-02-01), Bianco
patent: 4578133 (1986-03-01), Oshefsky et al.
patent: 4608115 (1986-08-01), Schroth et al.
patent: 4610751 (1986-09-01), Eschler
patent: 4617082 (1986-10-01), Oshefsky et al.
patent: 4645554 (1987-02-01), Wyser
patent: 4719855 (1988-01-01), Cannon et al.
patent: 4726876 (1988-02-01), Tomsovic, Jr.
patent: 4762582 (1988-08-01), de Jonckheere
patent: 4767487 (1988-08-01), Tomsovic, Jr.
patent: 4769098 (1988-09-01), Cederholm et al.
patent: 4776911 (1988-10-01), Uda et al.
patent: 4776920 (1988-10-01), Ryan
patent: 4786346 (1988-11-01), Ales et al.
patent: 4795510 (1989-01-01), Wittrock et al.
patent: 4801342 (1989-01-01), Wheeler et al.
patent: 4880178 (1989-11-01), Goulette
patent: 4909885 (1990-03-01), Swenson
patent: 4923546 (1990-05-01), Wheeler et al.
patent: 4987940 (1991-01-01), Straub et al.
patent: 4995939 (1991-02-01), Cohn
patent: 5021111 (1991-06-01), Swenson
patent: 5030311 (1991-07-01), Michal et al.
patent: 5041073 (1991-08-01), Eicker
patent: 5066346 (1991-11-01), Long et al.
patent: 5091039 (1992-02-01), Ujimoto et al.
patent: 5102485 (1992-04-01), Keeler et al.
patent: 5102486 (1992-04-01), Midgley et al.
patent: 5122216 (1992-06-01), Goodwin, III
patent: 5127981 (1992-07-01), Straub et al.
patent: 5131593 (1992-07-01), Siegfried et al.
patent: 5200020 (1993-04-01), Collins et al.
patent: 5235515 (1993-08-01), Ungpiyakul et al.
patent: 5244530 (1993-09-01), Collins et al.
patent: 5261996 (1993-11-01), Rossini
patent: 5286543 (1994-02-01), Ungpiyakul et al.
patent: 5314568 (1994-05-01), Ryan
patent: 5380381 (1995-01-01), Otruba
patent: 5383988 (1995-01-01), Herrmann et al.
patent: 5407507 (1995-04-01), Ball
patent: 5407513 (1995-04-01), Hayden et al.
patent: 5413651 (1995-05-01), Otruba
patent: 5415716 (1995-05-01), Kendall
patent: 5492591 (1996-02-01), Herrmann et al.
patent: 5549783 (1996-08-01), Schroeder et al.
patent: 5552007 (1996-09-01), Rajala et al.
patent: 5556504 (1996-09-01), Rajala et al.
patent: 5562793 (1996-10-01), Menard
patent: 5580411 (1996-12-01), Nease et al.
patent: 5582668 (1996-12-01), Kling
patent: 5591297 (1997-01-01), Ahr
patent: 5595335 (1997-01-01), Borel
patent: 5597437 (1997-01-01), Lange et al.
patent: 5643396 (1997-07-01), Rajala et al.
patent: 5659538 (1997-08-01), Stuebe et al.
patent: 5660657 (1997-08-01), Rajala et al.
patent: 5679195 (1997-10-01), O'Dwyer et al.
patent: 5693165 (1997-12-01), Schmitz
patent: 5695846 (1997-12-01), Lange et al.
patent: 5702551 (1997-12-01), Huber et al.
patent: 5705013 (1998-01-01), Nease et al.
patent: 5716478 (1998-02-01), Boothe et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Process and apparatus for cutting of discrete components of a mu does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process and apparatus for cutting of discrete components of a mu, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process and apparatus for cutting of discrete components of a mu will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-990757

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.