Process for preparing light-emitting diodes using a maximum laye

Fishing – trapping – and vermin destroying

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148DIG95, 437127, 437128, 437906, H01L 2166, H01L 2120

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active

050574426

ABSTRACT:
A light-emitting diode prepared by a new process is disclosed. The light-emitting diode has compound semiconductor epitaxial layers composed of GaAs.sub.1-x P.sub.x (0.ltoreq.x.ltoreq.1) on a compound semiconductor GaP single-crystal substrate, and has a light-emitting layer provided with a p-n junction formed in the surface layer region of the epitaxial layers. The diode is characterized in that it has a total maximum thickness of the epitaxial layers 20 to 40 .mu.m.
The process for preparing the diode is characterized in that the process can determine a required maximum thickness of the compound semiconductor epitaxial layers by presuming light output power from the thickness of the epitaxial layers based on the following equation:

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