Semiconductor module including wiring structures each having dif

Details Semiconductor module including wiring structures each having dif Semiconductor module including wiring structures each having dif

1993-03-19

1995-06-06

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257685, 257700, H01L 2348

Patent

active

054225159

ABSTRACT:
A semiconductor module having good heat dissipation and large current density includes an insulating substrate having a first group of wiring layers, a plurality of electronic components such as IC chips mounted on the insulating substrate and having bonding pads, an insulating sheet provided above the insulating substrate to cover the electronic components and having a second group of wiring layers, and a plurality of apertures formed in the insulating sheet and electrically connecting the first and second groups of wiring layers and the bonding pads to one another. The first group of wiring layers has a larger current capacity than the second group of wiring layers.

REFERENCES:
patent: 4677528 (1987-06-01), Miniet
patent: 4783695 (1988-11-01), Eichelberger
patent: 5274270 (1993-12-01), Tuckerman

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