Method of mounting an electronic part onto a printed circuit boa

Details Method of mounting an electronic part onto a printed circuit boa Method of mounting an electronic part onto a printed circuit boa

1990-09-20

1993-01-19

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

228248, 228258, H05K 334

Patent

active

051800977

ABSTRACT:
In a method of mounting an electronic component onto a printed circuit board by reflow mounting, the electronic component having a plurality of connection leads protruding from the component, a plurality of strips of solder are applied on a group of pads arranged in a line on the printed circuit board. The pads are disposed on the circuit in correspondence to the connection leads, and the connection leads of the electronic component are bonded to the corresponding pads by reflow soldering. By applying solder in strips, their widths need not be excessive, thereby avoiding solder bridging.

REFERENCES:
patent: 3786556 (1974-01-01), Weston
patent: 4381590 (1983-05-01), Nonnenmann et al.
patent: 4412643 (1983-11-01), Sato et al.
patent: 4428523 (1984-01-01), Snitzer et al.
patent: 4607782 (1986-08-01), Mims
patent: 4821946 (1989-04-01), Abe et al.
Office Action of French Application No. 9012064; and two articles cited therein.

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