Method of assembling ultra high density integrated circuit packa

Details Method of assembling ultra high density integrated circuit packa Method of assembling ultra high density integrated circuit packa

1994-03-04

1995-12-19

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29848, 235488, 235492, 437211, 437219, H01R 4300

Patent

active

054759200

ABSTRACT:
A method and apparatus for providing a multiple-element ultra high density level-two integrated circuit modular package utilizing a temporary manufacturing fixture to achieve a stack of individual thin ultra high density integrated circuit packages.

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Catalog of Dense-Pac Microsystems, Inc. describing two products: DPS512X16A3 Ceramic 512K X 16 CMOS SRAM Module and DPS512X16AA3 High Speed Ceramic 512K X 16 CMOS SRAM Module, pp. 865-870.

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