Low pressure CVD apparatus comprising gas distribution collimato

Coating apparatus – Gas or vapor deposition

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118724, C23C 1600

Patent

active

054218888

ABSTRACT:
The present invention provides a low-pressure CVD apparatus capable of forming a film with improved step coverage and which fills up contact holes without forming any seam therein. The low-pressure CVD apparatus comprises a CVD reaction chamber (6) provided with a source gas inlet (5), a susceptor (1) for supporting a wafer (2), and a gas distributing means (3) disposed between the source gas inlet (5) and a wafer (2) supported on the susceptor (1) to distribute a source gas uniformly over the surface of the wafer (2). The gas distributing means (3) is provided with a plurality of minute pores (16) serving as passages (10a) for the source gas and extending substantially perpendicularly to the surface of the wafer (2).

REFERENCES:
patent: 4798165 (1989-01-01), deBoer et al.
patent: 4886571 (1989-12-01), Suzuki et al.
patent: 4925809 (1989-05-01), Mieno
patent: 4999320 (1991-03-01), Douglas
patent: 5106453 (1992-04-01), Benko et al.
patent: 5108543 (1992-04-01), Suzuki et al.
patent: 5108778 (1992-04-01), Suzuki et al.
patent: 5264038 (1993-11-01), Hara et al.
patent: 5350480 (1994-09-01), Gray
Berry et al, Thin Film Technology, 1979, pp. 22-25.

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