Lead frame for a semiconductor device and a method for manufactu

Details Lead frame for a semiconductor device and a method for manufactu Lead frame for a semiconductor device and a method for manufactu

1987-10-13

1990-07-17

Hille, Rolf

357 67, H01L 2960

Patent

active

049424556

ABSTRACT:
A lead frame for a semiconductor device and a method for manufacturing the semiconductor device using the frame, the lead frame comprising a dice pad, inner leads, tie bar, outer leads and a thin metal layer of lead which is hard to melt and is easily transformed formed on the surface of that portion of the inner leads, outer leads and the tie bar which is not covered with the sealing resin. In injection molding of a resin material on the lead frame with a semiconductor chip therein, the gap between the lead frame and the mold is filled while the thin metal layer is transformed by the clamping pressure, so that the bur may be prevented from being generated.

REFERENCES:
patent: 4441118 (1984-04-01), Fister et al.
patent: 4625228 (1986-11-01), Bischoff et al.
patent: 4750029 (1988-06-01), Futatsuka et al.
patent: 4768077 (1988-08-01), Schere

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