Semiconductor device using bonding wires of different materials

Details Semiconductor device using bonding wires of different materials Semiconductor device using bonding wires of different materials

1991-03-12

1992-12-22

Gonzalez, Frank

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257784, 257741, H01L 2946, H01L 2954, H01L 2962

Patent

active

051737620

ABSTRACT:
Disclosed is a semiconductor device comprising a semiconductor integrated chip having at least a power processing circuit in which a larger current flows and a signal processing circuit in which a smaller current flows, each circuit having bonding pads, a package having leadframes, on which the semiconductor integrated chip is mounted, and a plurality of bonding wires with different materials through which the bonding pads are joined to the leadframes.

REFERENCES:
patent: 4845543 (1989-07-01), Okikawa et al.
patent: 5070041 (1991-12-01), Katayama et al.
patent: 5093712 (1992-03-01), Matsunaga et al.

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