Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1994-07-20
1995-08-08
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361767, 361784, 174260, 174261, 439 65, 439 74, H05K 102
Patent
active
054404541
ABSTRACT:
An electrical connecting device including a first circuit board providing thereon with input/output terminals, each of the terminals having a tip surface coated with gallium and a second circuit board providing thereon with contact terminals, each of the terminals having a tip surface coated with indium or tin. A low-melting point alloy layer is formed by a mutual action between gallium and indium or tin, when the input/output terminals of the first circuit board are in contact with the respective terminals of the second circuit board and electrically connected to each other. The second metal layer includes a plurality of wire-like metal supports extending substantially perpendicular to the surface of the terminal and a low-melting point metal retained by the wire-like metal supports.
REFERENCES:
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patent: 4950843 (1990-08-01), Hirota
patent: 4963002 (1990-10-01), Tagusa et al.
patent: 5017738 (1991-05-01), Tauji et al.
patent: 5088007 (1992-02-01), Missele
patent: 5219639 (1993-06-01), Sugawara et al.
Chiyonobu Tatsuo
Hashimoto Kaoru
Kawano Kyoichiro
Watanabe Kouji
Fujitsu Limited
Picard Leo P.
Thomas L.
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