Conductive polysulfone resine composition and high-heat-resistan

Details Conductive polysulfone resine composition and high-heat-resistan Conductive polysulfone resine composition and high-heat-resistan

1991-04-05

1992-12-22

Michl, Paul R.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

524609, C08K 304

Patent

active

051735245

ABSTRACT:
A conductive polysulfone resin composition which has excellent processability and is prepared by mixing (A) 100 parts by weight of a composition essentially consisting of from 5 to 95% by weight of an aromatic polysulfone resin and from 95 to 5% by weight of a polyphenylene sulfide resin with (B) from 3 to 40 parts by weight of conductive carbon, is provided by the present invention; and molded articles having excellent electrical conductivity, heat resistance and mechanical strength, for example, a high-heat-resistant, conductive semi-conductor-chip-carrier can be prepared from the composition by injection molding and other processing methods.

REFERENCES:
patent: 4690778 (1987-09-01), Narumiya et al.
patent: 4703081 (1987-10-01), Blackwell et al.
Patent Abstracts of Japan, vol. 14, No. 86, Feb. 19, 1990, p. 111 C 690 Kokai No. 01-299 872.
Database WPIL, No. 87-141 008, Derwent Publications Inc. & JPA 62-81450.
Patent Abstracts of Japan, vol. 4, 129, Sept. 10, 1990, Kokai No. 55-82 130.

Affiliated with

Also associated with

Rating

Conductive polysulfone resine composition and high-heat-resistan does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Conductive polysulfone resine composition and high-heat-resistan, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Conductive polysulfone resine composition and high-heat-resistan will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-975670