Solder paste for fastening semiconductors onto ceramic bases

Details Solder paste for fastening semiconductors onto ceramic bases Solder paste for fastening semiconductors onto ceramic bases

1990-02-21

1990-10-09

Dixon, Jr., William R.

Compositions: ceramic

Ceramic compositions

Glass compositions, compositions containing glass other than...

106 114, 106 119, 106 123, 501 11, 501 22, 501 64, 252514, C03C 818

Patent

active

049620665

ABSTRACT:
A solder paste for fastening semiconductors onto ceramic bases in a temperature range below 380.degree. C., consisting essentially of (1) 75 to 90% by weight of a mixture of silver powder and a low-melting glass powder with the weight ratio of silver to glass being between 2:1 and 9:1 and (2) 10 to 25% by weight of an organic solvent which contains 1 to 10% by weight of a thermally readily decomposable resin, the glass powder consisting essentially of 75 to 85% by weight lead oxide, 8 to 15% by weight boron oxide, 0.5 to 10% by weight silver (I) oxide 0.5 to 10% by weight bismuth (III) oxide, 0 to 5% by weight silicon dioxide, 0 to 2% by weight aluminum oxide 0 to 2% by weight tin oxide, 0 to 2% by weight zinc oxide, the glass powder having a glass transition temperature (Tg) of 250.degree. to 300.degree. C.

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patent: 4881974 (1989-11-01), Herrington
patent: 4904415 (1990-02-01), Lau et al.

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