Liquid epoxy resin composition for ball grid array package

Details Liquid epoxy resin composition for ball grid array package Liquid epoxy resin composition for ball grid array package

1999-01-21

2000-09-12

Lovering, Richard D.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

257793, 523428, C08G 5916, C08L 6302

Patent

active

061179531

ABSTRACT:
A liquid epoxy resin composition comprising (A) an epoxy resin component which includes specific amounts of three specific epoxy resins, (B) a curing agent, (C) a curing accelerator, and (D) an inorganic filler has a low viscosity, high cure rate, ease of processing, reliability, and shelf stability. The composition can be used as a semiconductor device encapsulant to provide BGA packages having minimal warpage.

REFERENCES:
patent: 3779949 (1973-12-01), Porret et al.
patent: 3888942 (1975-06-01), Tsen
patent: 4002599 (1977-01-01), Graham
patent: 4703338 (1987-10-01), Sagami et al.
patent: 5254605 (1993-10-01), Kim et al.
patent: 5439977 (1995-08-01), Yokota et al.
patent: 5554672 (1996-09-01), Saito et al.
patent: 5599628 (1997-02-01), Gardner
Semiconductor International (May 1989) P214-P218.
Nikkei Microdevices (Jul. 1987) P66-P67.

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