Method of forming an interconnection by an excimer laser

Details Method of forming an interconnection by an excimer laser Method of forming an interconnection by an excimer laser

1989-06-16

1990-10-09

Hall, Carl E.

Metal working

Method of mechanical manufacture

Electrical device making

174262, 204 15, 21912168, 21912169, 427 96, 427 97, H05K 302

Patent

active

049612590

ABSTRACT:
A raised metal connection feature (29) is created by forming a conductive pad (17) on a flexible substrate (11) and applying a flexible dielectric insulator (19) and photoresist layer (21) over the conductive pad (17). An excimer laser (25) is used to ablate a via (27) through the dielectric insulator (19) and photoresist (21) to the conductive pad (17). Gold or other metal is then plated up in the via (17), and the photoresist (21) is removed, leaving a metal feature (29) extending above the dielectric insulator (19).

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R. Srinivasan Ultraviolet Laser Ablation of Organic Polymer Films/IBM, Thomas J. Watson Research Center, pp. 343-354.
R. Srinivasan and B. Braren, Ultraviolet Laser Ablation and Etching of Polymethyl Methacrylate Sensitized with an Organic Dopant, Appl. Phys. A45, 289-292 (1988).

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