Protection circuit on a lead of a power device

Electricity: electrical systems and devices – Safety and protection of systems and devices – With specific current responsive fault sensor

Patent

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3073032, H02H 308

Patent

active

051703122

ABSTRACT:
A method for protecting a semiconductor power die has been provided. The method involves inserting an integrated circuit die between the gate lead of a package containing the semiconductor power die and the actual gate terminal of the semiconductor power die. As a result, any current flowing into the gate lead of the package must pass through the integrated circuit die before entering the semiconductor power die. This allows the integrated circuit die to monitor and control the semiconductor power die.

REFERENCES:
patent: 4288829 (1981-09-01), Tango
patent: 4818895 (1989-04-01), Kaufman
patent: 5023684 (1991-06-01), Tsunoda

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