Polyamideimidesiloxane hot melt adhesive

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...

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C09J 400

Patent

active

061568201

ABSTRACT:
Disclosed is a solution of a hot melt adhesive which comprises an organic solvent and a fully imidized polyamideimidesiloxane. The polyamideimidesiloxane is the reaction product of dianhydride monomer with diamine monomer. About 0.5 to about 30 mole % of the monomers are siloxane-containing diamine or dianhydride monomers. Up to about 50 mole % of the diamine monomer is aliphatic diamine that contains neither siloxane groups nor amide linkages, and about 40 to about 99 mole % of the diamine monomer is aromatic diamine that does not contain siloxane groups. The aromatic diamine is (1) about 50 to about 100 mole % unsymmetrical aromatic diamine that has at least two aromatic rings, two amine groups on different aromatic rings, and contains an amide linkage in the chain and (2) up to about 50 mole % of aromatic diamine that contains neither siloxane groups nor amide linkages. A tape is made by forming a coating of the solution on a film. An article can be attached to a substrate by applying the tape to the substrate or the article, heating the tape above its softening point, and pressing the article or substrate, respectively, into the tape.

REFERENCES:
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patent: 5258461 (1993-11-01), Facci
patent: 5714572 (1998-02-01), Kato
Dezern, "Synthesis and Characterization of Polyamide-Imides," Polymer Engineering and Science, vol. 31, No. 12 (1991).

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