Solid state electronic device

Electrical generator or motor structure – Non-dynamoelectric – Piezoelectric elements and devices

Patent

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Details

Other Related Categories

310313B, 310363, 310364, 310313A, H01L 4108

Type

Patent

Status

active

Patent number

049423274

Description

ABSTRACT:
A solid state electronic device having a thin film of an Al (aluminum) alloy Li (lithium) on the surface of a substrate for a surface acoustic wave (SAW). Interdigital electrodes, electric wiring patterns and bonding pads are formed by the thin film of the Li-added Al alloy. This thin film suppresses migration which occurs when a high density current is supplied to the device or a large amplitude SAW is generated. The thin film, which provides a small loss and relatively low hardness, provides a desired power handling capability and high yield of wire bonding. The this film assures high endurance to failure of the device and sufficient life of the device.

REFERENCES:
patent: 4489250 (1984-12-01), Ebata et al.
patent: 4775814 (1988-10-01), Yuhara et al.
Transactions of the Institute of Electronics & Communications Engineers of Japan, vol. J67 C, No. 3, (Mar. 1984), pp. 278-285.
IEEE Transactions on Parts, Hybrids and Packaging, vol. PHP-7, No. 3, pp. 134-138.

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