Method for fastening a semiconductor, body provided with at leas

Details Method for fastening a semiconductor, body provided with at leas Method for fastening a semiconductor, body provided with at leas

1991-09-06

1992-12-08

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437211, 437212, 437221, 228123, 257678, H01L 2160

Patent

active

051698048

ABSTRACT:
In a method for fastening a semiconductor body provided with at least one component to a substrate, an under side of the semiconductor body is provided with a first contacting layer and with a powdered metal layer covering this first contacting layer. An upper side of the substrate is provided with a second contacting layer. The coated surfaces of the semiconductor body and of the substrate are then pressed together while being heated. When the semiconductor body is composed of a part of a semiconductor wafer that comprises a plurality of identical or similar parts, then the first contacting layer and the powdered metal layer of the invention are applied in common on the back side of the semiconductor wafer for all semiconductor bodies. The powdered metal layer is sintered, the semiconductor wafer is glued onto an adhesive film, the semiconductor wafer is subsequently pre-sawed or sawed through along parting lines that surround the semiconductor bodies, and the isolated semiconductor bodies are pulled off from the adhesive film and fastened on the substrate.

REFERENCES:
patent: 4742024 (1988-05-01), Sugimoto et al.
patent: 4810672 (1989-03-01), Schwarzbauer
patent: 4814295 (1989-03-01), Mehtu
patent: 4818728 (1989-04-01), Rai et al.
patent: 4849374 (1989-07-01), Chen et al.
patent: 4903885 (1990-02-01), Schwarzbauer
patent: 4999077 (1991-03-01), Drake et al.

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