Multiple chip module for packaging integrated circuits

Details Multiple chip module for packaging integrated circuits Multiple chip module for packaging integrated circuits

1996-04-22

1998-03-17

Kincaid, Kristine L.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

361808, 174 524, H01L 2304

Patent

active

057289727

ABSTRACT:
A multiple chip module for packaging integrated circuit chips. It has a module body with multiple faces and covers. One of the faces has conduction pads. Each of the other faces has a chip receiving compartment. Each compartment includes at least one chip receiving section. The bottom boundary of the chip receiving section faces the center of the module body and each chip receiving section includes a base surrounding its bottom boundary for locating and bonding one of the chips. Conduction areas are provided on the base of each of the chip receiving sections for connecting with the pad windows of one of the chips and are connected with corresponding conduction pads through a layout in the module body. The covers cover the chip receiving compartments for sealing the chips therein.

REFERENCES:
patent: 5327325 (1994-07-01), Nicewarner, Jr.

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