Semiconductor memory module

Static information storage and retrieval – Interconnection arrangements

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Details

365 51, 365 52, 365226, 257691, G11C 514

Patent

active

053392698

ABSTRACT:
A memory module includes electrodes arranged on one side edge of a laminated substrate. A plurality of memory elements are mounted on the surface of the laminated substrate, wherein signal line electrodes for the memory elements are arranged on one side edge of the laminated substrate, and respective electrode terminals for a second power supply line and a second grounding line connected in parallel to a first power supply line and a first grounding line are provided on a surface of the laminated substrate. The electrodes are situated at a position at or near maximum amplitude of the potential distribution generated on the first power supply line and the first grounding line when the memory elements are driven.

REFERENCES:
patent: 4577214 (1986-03-01), Schaper
patent: 4608592 (1986-08-01), Miyamoto
patent: 4742385 (1988-05-01), Kohmoto
patent: 5007025 (1991-04-01), Hwang et al.
patent: 5119169 (1992-06-01), Kozono et al.
patent: 5231607 (1993-07-01), Yoshida et al.

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