Printable superconductive leadframes for semiconductor device as

Details Printable superconductive leadframes for semiconductor device as Printable superconductive leadframes for semiconductor device as

1995-08-07

1998-03-17

Graybill, David

Fishing, trapping, and vermin destroying

437196, 437217, 437220, 505191, 505220, 505330, 505703, 505706, 505741, H01L 21283, H01L 2148, H01L 2158, H01L 2160

Patent

active

057285993

ABSTRACT:
Process for manufacturing a high interconnection density, fine-line, superconductive printed leadframes using thick-film screen-printing techniques, or other printing techniques. Generally, a superconductive leadframe pattern is printed on a backing substrate. Once the pattern is cured, the backing substrate, or portions thereof can be removed. The backing substrate can be a "fish paper" substrate treated with a release agent, or other substrate material which can be dissolved away, etched away, or otherwise removed. Portions of the backing substrate can be used to provide mechanical integrity for the leadframe. The leadframe fingers can be printed using a superconductive paste or a superconductive precursor paste which is subsequently treated to exhibit superconductivity.

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patent: 5468679 (1995-11-01), Paz De Araujo et al.
patent: 5593918 (1997-01-01), Rostoker et al.

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