Thermal arched beam microelectromechanical actuators

Electrical generator or motor structure – Non-dynamoelectric – Thermal or pyromagnetic

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310306, H02N 1100, H01G 700, F01L 100

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active

059090782

ABSTRACT:
Microelectromechanical actuators include at least one arched beam which extends between spaced apart supports on a microelectronic substrate. The arched beams are arched in a predetermined direction and expand upon application of heat thereto. A coupler mechanically couples the plurality of arched beams between the spaced apart supports. Heat is applied to at least one of the arched beams to cause further arching as a result of thermal expansion thereof, and thereby cause displacement of the coupler along the predetermined direction. Internal heating of the arched beams by passing current through the arched beams may be used. External heating sources may also be used. The coupler may be attached to a capacitor plate to provide capacitive sensors such as flow sensors. The coupler may also be attached to a valve plate to provide microvalves. Compensating arched beams may be used to provide ambient temperature insensitivity.

REFERENCES:
patent: 1258368 (1918-09-01), Smith
patent: 1658669 (1928-02-01), Cohn et al.
patent: 3213318 (1965-10-01), Glenn
patent: 4806815 (1989-02-01), Honna
patent: 5184269 (1993-02-01), Shimada et al.
patent: 5355712 (1994-10-01), Petersen et al.
patent: 5441343 (1995-08-01), Pylkki et al.
patent: 5475318 (1995-12-01), Marcus et al.
patent: 5558304 (1996-09-01), Adams
patent: 5600174 (1997-02-01), Reay et al.
patent: 5629665 (1997-05-01), Kaufmann et al.
patent: 5659285 (1997-08-01), Takeda
Klassen, et al., Silicon Fusion Bonding And Deep Reactive Ion Etching; A New Technology For Microstructures, Transducers '95 -Eurosensos IX, The 8th International Conference On Solid State Sensors And Actuators, and Eurosensors IX, Stockholm, Sweden, Jun. 25-29, 1995, pp. 556-559.
Noworolski, et al., Fabrication Of SOI Wafers With Buried Cavities Using Silicon Fusion Bonding And Electrochemical Etchback, Transducers '95 -Eurosensors IX, The 8th International Conference On Solid State Sensors And Actuators, and Eurosensors IX, Stockholm, Sweden, Jun. 25-29, 1995, pp. 71-74.
Single Crystal Silicon Actuators And Sensor Based On Silicon Fusion Bonding Technology, Semi-Annual Progress Report 1, Advanced Research Projects Agency, Lucas NovaSensor, Contract No. DAL 01-94-C-2411, Apr. -Jul. 1994.
Single Crystal Silicon Actuators And Sensors Based On Silicon Fusion Bonding Technology, Semi-Annual Progress Report 2, Advanced Research Projects Agency, Lucas NovaSensor, Contract No. DAL 01-94-C-3411, Jul., 1994 -Jan. 1995.
Single Crystal Silicon Actuators And Sensors Based On Silicon Fusion Bonding Technology, Semi-Annual Progress Report, Advanced Research Projects Agency, Lucas NovaSensor, Contract No. DAL 01-94-C-3411, Jan. -Jul. 1995.
Single Crystal Silicon Actuators And Sensors Based On Silicon Fusion Bonding Technology, Semi-Annual Progress Report, Advanced Research Projects Agency, Lucas NovaSensor, Contract No. DAL 01-94-C-3411, Jan. -Aug. 1996.
Phipps, Thesis: "Design and Development of Microswitches for Micro-Electro-Mechanical Relay Matrices", Air Force Inst. of Tech., Wright-Patterson AFB, OH School of Engineering, 1995.
Yamagata et al., "a Micro Mobile Mechanism Using Thermal Expansion and Its Theoretical Analysis --A Comparison with Impact Drive Mechanism Using Piezoelectric Elements", Proceedings of the IEEE Micro Electro Mechanical Systems, 1994, pp. 142-147.
Oh et al., "Thin Film Heater on a Thermally Isolated Microstructure", Smart Materials Fabrication and Materials for Micro-Electro-Mechanical Systems, 1992, pp. 277-282.
W.H. Safranek, "The Properties of Electrodeposited Metals & Alloys", Amer. Electroplaters & Surface Finishers Society, 1986, pp. 295-315.

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