Flexible lead structures and methods of making same

Details Flexible lead structures and methods of making same Flexible lead structures and methods of making same

1999-03-12

2000-09-12

Leary, Louise N.

Semiconductor device manufacturing: process

With measuring or testing

438131, 438118, 438127, 438689, 438682, 439 66, 439 91, 437225, H01R 909, H01L 21302

Patent

active

06117694&

ABSTRACT:
A microelectronic component, such as a connector or a packaged semiconductor device is made by connecting multiple leads between a pair of elements and moving the elements away from one another so as to bend the leads toward a vertically extensive disposition. One of the elements includes a temporary support which is removed after the bending operation and after injecting and curing a dielectric material to form a dielectric layer surrounding and supporting the leads.

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