Method for mirror-polishing chamfered portion of wafer and mirro

Abrading – Abrading process – Glass or stone abrading

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Details

451 57, 451 65, 451221, 451254, B24B 100, B24B 724, B24B 914

Patent

active

057279900

ABSTRACT:
A method and an apparatus, which enable mirror-polishing a peripheral chamfered portion of a semiconductor wafer effectively, are disclosed. Mirror-polishing a peripheral side surface of the chamfered portion of the wafer, beveled surfaces thereof, and rounded edges formed between the peripheral side surface and each of the beveled surfaces, are individually carried out.

REFERENCES:
patent: 4286415 (1981-09-01), Loreto
patent: 4344260 (1982-08-01), Ogiwara
patent: 4793101 (1988-12-01), Dlouhy et al.
patent: 5295331 (1994-03-01), Honda et al.

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