Assembly packaging method for sensor elements

Details Assembly packaging method for sensor elements Assembly packaging method for sensor elements

1989-08-29

1990-08-07

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

437209, H05K 1304, H01R 4300

Patent

active

049456342

ABSTRACT:
A method of mounting electrodes on a sensor chip and coating the sensor chip for insulation. Small through holes corresponding to the connecting terminals of a sensor chip for connecting the sensor chip to external elements and electrode patterns serving as lead frames are continuously provided for respective sensors in the longitudinal direction on a sheet-like tape carrier composed of a protective insulation material. The sensor chips are mounted on the tape carrier and the terminals of the sensor chips are connected to the corresponding electrode patterns through the corresponding small through holes, thereby completing the assembly packaging a sensor of a plurality of sensor elements. The thus-obtained sensor elements arranged in alignment and in parallel on the tape carrier are separated from each other and mounted on respective sensor bases and packaged.

REFERENCES:
patent: 4038744 (1977-08-01), Cheype et al.
patent: 4835847 (1989-06-01), Kamperman

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