Microelectronic connections with liquid conductive elements

Details Microelectronic connections with liquid conductive elements Microelectronic connections with liquid conductive elements

1996-05-02

1998-09-15

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361767, 361771, 361774, 361779, 361789, 361790, 361803, 439179, 439591, H05K 109, H05K 111, H01R 308, H01R 400

Patent

active

058088741

ABSTRACT:
A microelectronic assembly including elements such as a semiconductor chip and substrate has electrical connections between the elements incorporating fusible conductive metal masses. The fusible masses are surrounded and contained by a compliant material such as an elastomer or gel. The fusible material may melt during operation or processing of the device to relieve thermal cycling stress in the electrical connections.

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